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  • Small wires make big connections for microelectronics

    Min-Feng Yu, a professor of mechanical science and engineering, and his graduate student have developed a novel approach for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.

    Min-Feng Yu, a professor of mechanical science and engineering, and his graduate student have developed a novel approach for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.

    Photo by L. Brian Stauffer

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      Min-Feng Yu, a professor of mechanical science and engineering, and his graduate student have developed a novel approach for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.

      Photo by L. Brian Stauffer

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      Illinois researchers can make tiny wire bonds to connect integrated chips using a direct-write technique. A micropipette nozzle is like a tiny fountain pen that writes the wire bonds in 3-D space with metal instead of ink.

      Image courtesy Min-Feng Yu

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